Mega-Idea Universal BGA Reballing Stencil
Description
Built for technicians who demand precision, it ensures perfect solder ball alignment, faster repair time, and high success rates. Ideal for mobile, laptop, GPU, and console motherboard repairs
Specifications
Type: Universal BGA Reballing Stencil
Material: High-quality stainless steel
Design: Laser-cut, ultra-precise holes
Compatibility: Multiple BGA chip sizes
Heat Resistance High-temperature safe
Thickness: Optimized for clean solder flow
Reusability: Long-lasting & reusable
Brand: Mega-Idea
Applications
Mobile phone CPU / IC reballing
Laptop & motherboard repair
Game console (PS, Xbox) BGA repair
GPU & chipset rework
Professional electronics servicing
Advanced repair labs & workshops