Kaisi BGA Reballing Stencil
Description:
High-precision BGA reballing stencil designed for accurate solder ball placement on BGA chips. Ideal for mobile phone and electronics repair, ensuring professional-level PCB and chip work.
Specifications:
Type: BGA Reballing Stencil
Material: Durable stainless steel
Precision: Accurate solder ball alignment
Reusable & long-lasting
Applications:
Mobile phone BGA chip repair
SMD & BGA reballing
Laptop & electronics repair
Chip-level PCB repair
Whole Ethiopia coverage
Contact for price: 15
|
| +