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Addis Ababa, Bole, 20/05
11 views
Bga Dirctiy Heat Reballing Chip Rwork Rpair
HEAT REBALLING CHIP RWORK
Brand
HEAT REBALLING CHIP RWORK
Type
Brand New
Condition
Iteam no 03-19√ model no 56:
√ ብዛት pcs no :. 1
see እይ description ዝርዝርcomponent removal. you need to pre-heat the pcb and then apply heat to the top of the bga component that you need to remove. . deballing. . clean the deballed part. . apply paste flux. . attach the preform ball. . place device on top of the preform. . inspect. . to conclude:
all prices are fixed without vat
check our link all 5 in 1
if you want delivery advance payment እንዲላክሎት ቀድመው ይከፍላሉ
working days are from monday to sunrday
አድራሻ addresssee እይ megenagna mulgeta building second 2 floor tether tech
መገናኛ ሙልጌታ ህንፃ 2ኛ ፎቅ ቴዘር-ቴክ ይምጡ
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