93pcs reballing stencils set + forward fw-zc01 cpu dual-sided reballing platform
the 93pcs reballing stencils set with forward fw-zc01 cpu dual-sided reballing platform is a professional solution for mobile phone cpu, ic, bga, emmc/ufs and motherboard reballing. the combination of multiple precision
specifications
stencil set: 93 pcs
platform model: forward fw-zc01
type: cpu dual-sided reballing platform
application: ic / cpu / bga reballing
suitable for: mobile phone motherboard repair
design: dual-sided positioning fixture
use: solder-ball placement, alignment & rework
applications
iphone & android motherboard repair
cpu reballing
emmc / ufs rework
bga ic reballing
smd & micro-component repair
chip rework & solder-ball replacement