አዲስ አበባ, ኮልፌ ከራኒዮ, 21/06
29 እይታዎች
Bga Reballing Stencil
የቴሌቪዥን እና ዲቪዲ አክሰሰሪዎች
አይነት
አዲስ
ሁኔታ
Other
ብራንድ
የሱቅ አድራሻ
አዲስ አበባ • ቦሌ
Whole Ethiopia
Call
Open
• ሰኞ - ቅዳሜ, 09:00-18:00
አዲስ አበባ • ኮልፌ ከራኒዮ
Addis Ababa
Open
• ሰኞ - እሑድ, 08:00-22:00
Amaoe EMMC-3 BGA Reballing Stencil
Description:
High-precision BGA reballing stencil designed for eMMC chips. Ensures accurate solder ball placement for mobile phone and electronics repair. Perfect for professional technicians working on delicate PCB and chip-level repairs.
Specifications:
Type: BGA Reballing Stencil
Compatibility: eMMC-3 chips
Material: High-quality stainless steel
Precision: Accurate solder ball alignment
Reusable & durable
Applications:
Mobile phone eMMC chip repair
BGA reballing & soldering
Laptop & small electronics repair
Chip-level PCB repair
Delivery: all over Ethiopia
Whole Ethiopia coverage
Contact for price: 17
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የደህንነት ምክሮች
- እንኳንም ለመላኪያ በቅድሚያ መክፈልን ይቀልዱ
- ከሻጭ ጋር በደህንነቱ የተጠበቀ የህዝብ ቦታ ውስጥ ይገናኙ
- እቃውን ይመልከቱ እና በትክክል የሚፈልጉት መሆኑን ያረጋግጡ
- ተሸክመው የተላኩት እቃ የተመረምረው መሆኑን ያረጋግጡ
- እርካታ ካልሰማምን ብቻ ይክፈሉ
